Assembly method for large scale integrated circuits

摘要

The method involves a lower substrate (7) with connector pads (8,81) and soldering feet (9) which fit into holes in the second substrate (2). The second substrate has a central hole for the LSI chip (1) and internal connections (5) which run along the base of the chip. There are further smaller holes for the solder feet connection, each of which has an inserted lower/upper substrate connection (3). Track patterns are formed on both sides of the upper substrate. Assembly is by inserting the solder feet into the holes and heating. A layer of resin (10) is placed between the substrates and left to harden.