In the lead frame with lead-on-chip assembly (LOC) in the inner lead region, the leads (35,36) in the inner lead region are formed in several layers. The lead tips which point in the direction of the pads are offset from each other for each of the leads which lie one below the other. The leads are fixed on the chip with lead-on-chip technology. A naked chip assembly is provided in the outer lead region as well as in the inner lead region. A multi-layer lead-frame is also provided in the outer lead region.
