发明名称 METHOD FOR FORMING PARTICLE LAYER ON SUBSTRATE, METHOD FOR FLATTENING IRREGULAR SUBSTRATE SURFACE, AND PARTICLE-LAYERED SUBSTRATE
摘要 A method for forming a particle layer on a substrate comprising the steps of: developing a dispersion liquid (I) obtained by dispersing in a dispersion medium solid particles surface-treated with a compound capable of forming a binder, on a liquid (II) incompatible with the dispersion medium; removing the dispersion medium from the dispersion liquid (I) to form a particle layer in which the solid particles are arranged; and transferring the particle layer onto a substrate. The method provides a substrate with a particle layer having a high adhesion to the substrate. A method for flattening an irregular substrate surface comprises the steps of: transferring the particle layer formed by the first method to an irregular surface of a substrate; and removing portions of the particle layer formed on protuberances of the substrate. A particle-layered substrate comprises a particle layer obtained by the above methods on the substrate.
申请公布号 WO9604998(A1) 申请公布日期 1996.02.22
申请号 WO1995JP01610 申请日期 1995.08.11
申请人 CATALYSTS & CHEMICALS INDUSTRIES CO., LTD.;NAKASHIMA, AKIRA,;KOMATSU, MICHIO,;OHNO, KENJI,;TERAMOTO, KUNIHARU,;INOUE, KAZUAKI, 发明人 NAKASHIMA, AKIRA,;KOMATSU, MICHIO,;OHNO, KENJI,;TERAMOTO, KUNIHARU,;INOUE, KAZUAKI,
分类号 B01J19/00;B05D1/20;G11B5/84;G11B7/26;H01L21/768;(IPC1-7):B05D1/20 主分类号 B01J19/00
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