| 摘要 |
<p>A soldering inspection method and an apparatus therefor capable of improving soldering inspection accuracy by obtaining a higher precision X-ray transmission image corresponding well to the actual shape of a circuit board. The soldering inspection method comprises a step (23) of obtaining a one-face transmission image by irradiating X-rays to a circuit board having components mounted on only one side, steps (22, 27) of executing soldering inspection by using the one-side transmission image, a step (17) of obtaining a transmission image of a two-sided board by directing X-rays to the substrate having components mounted on both sides, steps (15, 18) of executing response correction so as to make response characteristics substantially constant within a predetermined spatial frequency range on the basis of the response characteristics to the spatial frequency of the imaging system and the image processing system in a transmission image read step of the one-side transmission image and the two-side transmission image, a step (20) of obtaining a transmission image of only the other side by subtracting the one-side transmission image subjected to response correction from the transmission image of the two-sided board subjected to response correction, and a step (21) of executing soldering inspection of the other side by using the transmission image of the other side. The present invention provides an apparatus for practicing this method.</p> |
