发明名称 Chemically amplified radiation-sensitive composition
摘要 <p>A chemically amplified-type radiation-sensitive composition comprising: (a) an alkali-soluble binder resin made by a condensation reaction of: (i) hydroxystyrene moiety having formula Ä1Ü or Ä2Ü: <CHEM> <CHEM> wherein x is an integer from 2 to 300; with (ii) a monomethylolated phenolic compound having a formula Ä8Ü: <CHEM> wherein R1 and R2 are individually selected from the group consisting of lower alkyl group having 1-4 carbon atoms, lower alkoxy group having 1-4 carbon atoms, amino group, and carboxylic acid group; wherein R3 and R4 are individually selected from the group consisting of hydrogen, lower alkyl group having 1-4 carbon atoms, lower alkoxy groups having 1-4 carbon atoms, an amino group, and a carboxylic group; and wherein a mole ratio of the hydroxy- styrene moiety to the monomethylolated phenolic compound is from about 1:10 to about 10:1; (b) at least one alkaline dissolution inhibitor containing acid-cleavable groups; and (c) at least one compound that results in generation of an acidic moiety under irradiation.</p>
申请公布号 EP0697632(A2) 申请公布日期 1996.02.21
申请号 EP19950305402 申请日期 1995.08.02
申请人 OCG MICROELECTRONIC MATERIALS, INC. 发明人 HONDA, KENJI
分类号 C08F12/22;C08F12/00;C08F12/24;C08G8/28;C08G8/30;C08G8/38;C08L25/00;C08L25/18;C08L61/00;C08L61/04;C09K13/06;G03F7/004;G03F7/023;G03F7/039;H01L21/027;(IPC1-7):G03F7/004 主分类号 C08F12/22
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