| 摘要 |
A fine pitch lead frame and a method for manufacturing the same is disclosed herein. A preferred embodiment of a fine pitch lead frame is generally comprised of a plurality of fine pitch leads (42), a die pad area (217, 72), and die pad area support arms (15). The leads are comprised of a base lead portion formed in an unetched region (32) and a fine pitch lead tip portion (42) formed in an etched region (30) on an electrically conductive material. The base lead portions (40) are substantially the same thickness as the conductive substrate (32) and the lead tip portions (42) are of a smaller thickness. Etching one or more region(s) on an electrically conductive substrate (32) of a substantial uniform thickness to a fraction of the thickness of the unetched regions (30) allows for the formation of fine pitch lead tips (42) in the etched region(s). Some possible methods for forming the leads (42) include an additional etching, stamping out the leads with a finely tapered stamp tool punch or using conventional stamp tool punches (180) in conjunction with finer stamp tool punches (80, 82) to create the fine pitch lead tips (42). There is also disclosed examples to various methods for forming the fine pitch lead frame in different configurations. |
