| 摘要 |
PURPOSE:To provide a resin sealed semiconductor device with a plurality of semiconductor chips packaged in high density by reducing the area of a resin molding section. CONSTITUTION:Semiconductor chips 3 are bonded with die pad sections 4, and the die pad sections 4 are connected to inner lead section 5 by metallic small-gage wires 6 from the semiconductor chips 3, thus forming a semiconductor circuit section. A plurality of the semiconductor circuit sections are arrayed and sealed vertically to a mounting circuit board 7 in one molding section. Consequently, a resin area per one molding can be reduced, and a plurality of the semiconductor chips can be packaged in one mold with high density. Accordingly, the area of the mounting circuit board 7, which mounts resin sealed semiconductor devices, can be reduced and the semiconductor devices can also correspond to the increase of density. |
