HEAT STABILITY COMPOSITION

摘要

PURPOSE: To provide a new intermediate body compound that can be applied to a semiconductor precursor by the spin-on technique, shows improved flatness and gap-filling characteristics, and enables a composition after curing to withstand a temperature exceeding a specific temperature. CONSTITUTION: A composition is made of perylene anhydride and aminosilane and contains perylene diimide and alkyl poly (silsesquioxane). The composition can be used as a mask or mandrel that is useful in a process in an IC- manufacturing process, especially a process being exposed to a temperature exceeding 500 deg.C and can be eliminated by such means as a known CF4 /O2 RIE and chemical/mechanical polishing.