| 摘要 |
PURPOSE:To obtain a photosensitive resin compsn. developable with an aq. soln. causing no problem of safety or environmental problem and excellent in heat resistance, adhesiveness and flame retarding property and to obtain a printed circuit board using the resin compsn. CONSTITUTION:This photosensitive resin compsn. contains epoxy acrylate having a carboxyl group, epoxy resin and at least one kind of acrylate compd. as a halogen substitution product. This compsn. can be developed with a developer almost harmless to the human body and not corresponding to a dangerous article, gives a coating film excellent in resolution, heat resistance, adhesiveness and flame retarding property and can be used as a soldering resist, a plating resist or an interlaminar insulating layer for a multilayered printed circuit board. |
