发明名称 X-RAY MASK AND MANUFACTURING METHOD AND DEVICE THEREOF
摘要 <p>PURPOSE:To enable an X-ray absorber pattern of an X-ray mask to be accurately formed by a method wherein an etching mask specified in thickness basing on the thickness and required pattern accuracy of the X-ray absorber is disposed. CONSTITUTION:An etching mask 5 is arranged over an X-ray absorber 4, and the X-ray absorber 4 is patterned by the use of a resist pattern 6'. At this point, an etching mask 5 of thickness dl shown in a formula (etching selection ratio of an etching mask to X-ray absorber is represented by z, thickness of etching mask is de, thickness of X-ray absorber is dx, required pattern size of X-ray absorber is represented by dl, and required pattern accuracy of X-ray absorber is a (%)) is used. By this setup, an X-ray absorber can be etched high in dimensional accuracy, and an X-ray mask of high accuracy can be obtained high in yield.</p>
申请公布号 JPH0851066(A) 申请公布日期 1996.02.20
申请号 JP19950035131 申请日期 1995.02.23
申请人 MITSUBISHI ELECTRIC CORP 发明人 YABE HIDETAKA;MARUMOTO KENJI;KICHISE KOJI;AYA ATSUSHI;MATSUI YASUTSUGU;SASAKI KEI
分类号 G03F1/22;G03F1/40;G03F1/68;G03F1/80;H01L21/027;H01L21/302;H01L21/3065;(IPC1-7):H01L21/027;G03F1/16;H01L21/306;G03F1/08 主分类号 G03F1/22
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