METHOD FOR PROTECTION OF CONTACT PAD OF MEMORY CARD

摘要

PURPOSE: To protect electroconductive contact pads of a memory card by inserting insulator in a space between the contact pads and coating the edges of the contact pads which face each other with the insulator in the space. CONSTITUTION: Contact pads are arranged in parallel and also are as high as the surface of a card. An integrated circuit chip is placed on top of the contact pads around the central contact pads inside a card body. These contact pads are separated from each other by a space 5. The contact pads 6 and 7 are held by a supporter 8 for an insulator, and the supporter 8 can be replaced by the card body itself. The pads 6 and 7 are flat, and the depth of the space 5 is equal to the thickness of the pads 6 and 7. Then, the insulator 9 is inserted into each space 5 and coats the edges of the pads 6 and 7 which face each other in each space 5.