发明名称 MASK FORMING METHOD
摘要 <p>PURPOSE:To apply a phase shift mask when a very fine pattern region of a device is exposed to light and a usual transmitting mask when the rest of the device is exposed to light in a reduced projection exposure method when a device pattern is formed. CONSTITUTION:One or two different masks having a phase shift mask region and a light transmitting-type mask region are laid on a specimen at the same position overlapping each other, and then the specimen is subjected to a light exposure process. By the above-mentioned method, the very fine pattern region and the circuit pattern region of the specimen can be exposed to light at the same time. By this setup, a device with a very fine pattern can be easily patterned and easily formed high in throughput and profitability.</p>
申请公布号 JPH0851068(A) 申请公布日期 1996.02.20
申请号 JP19950111528 申请日期 1995.05.10
申请人 HITACHI LTD 发明人 FUKUDA HIROSHI;TERASAWA TSUNEO;HASEGAWA NORIO;TANAKA TOSHIHIKO;OSHIMA TAKU
分类号 G03F1/30;G03F1/68;G03F7/20;H01L21/027;(IPC1-7):H01L21/027;G03F1/08 主分类号 G03F1/30
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