发明名称 SUBSTRATE MOUNTING TERMINAL
摘要 PURPOSE:To provide the substrate mounting terminal which does not stain an electrical contact surface by the over-flow of flux at the time of soldering, and also does not cause any increase in electrical resistance. CONSTITUTION:A terminal 11 is formed into a U shape in cross section with both end sections of its rectangular metallic flat plate bent, solder connecting sections 1b and 1c are provided for both the end sections, and an electrical contact surface 1a is provided for the upper surface of a flat section 1A between both the end sections. Furthermore, U shaped bent sections 12a and 12b are provided for both peripheral sections of the electrical contact surface 1a, which actually extend the lengthwise surface distance from the electrical contact surface 1a to the solder connecting sections 1b and 1c.
申请公布号 JPH0850943(A) 申请公布日期 1996.02.20
申请号 JP19940185928 申请日期 1994.08.08
申请人 MURATA MFG CO LTD 发明人 NAKASAKA MASASHI
分类号 H01R12/32;H01R12/04;(IPC1-7):H01R9/09 主分类号 H01R12/32
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