| 摘要 |
<p>PURPOSE:To provide the mounting structure of a bare chip, in which the peeling and cracking of a bare chip can be prevented while positively dissipating heat, and a heat sink. CONSTITUTION:A bare chip 7 and a heat sink 5 as a high heat conductive support member are bonded through an adhesive layer 6 in mounting structure, and irregularities are formed to the bare-chip mounting surface S1 of the heat sink 5. Accordingly, difference is generated in a heat-dissipating path, and heat distribution is formed in the bare chip 7.</p> |
