| 摘要 |
PURPOSE:To provide the mounting structure of a heat sink, cooling efficiency of which is improved and which is mounted easily. CONSTITUTION:In structure, in which a heat sink is installed to an integrated circuit package, the integrated circuit package 34, the heat sink 20 placed on the integrated circuit package 34, and a fixing means 36 fixing the heat sink 20 onto the integrated circuit package 34 so that the underside of the heat sink 20 is fast stuck onto the top face of the integrated circuit package 34 are contained. The fixing means 36 comprises a beltlike member 38, pairs of forked members 40 integrally connected at both ends of the beltlike member, and pairs of engaging members 42 integrally coupled with each of the forked members 40. Each engaging member 42 is engaged with the corner sections of the diagonals of the integrated circuit package 34, and each forked member 40 is adapted so as to be pushed and contacted to the side faces of the heat sink 20. |
