发明名称 INTEGRATED CIRCUIT CHIP
摘要 PROBLEM TO BE SOLVED: To eliminate the undesirable leakage of a surface current in a high- voltage power integrated circuit. SOLUTION: A polysilicon field ring structure has a high-voltage region 40 add a low-voltage region 41, and at the same time is used to eliminate the leakage of an undesirable surface current in a power chip 20 that is formed into an integrated circuit being surrounded by a plastic housing 81. All P-type diffusion regions that are not biased to the grounding potential is surrounded by rings 70 and 71 that are biased to a supply power supply potential, and all N-type diffusion regions that are not biased to the supply power supply potential are surrounded by a ring that is biased to the ground potential.
申请公布号 JPH0846059(A) 申请公布日期 1996.02.16
申请号 JP19950170709 申请日期 1995.07.06
申请人 INTERNATL RECTIFIER CORP 发明人 CHIYONUTSUKU KURISU CHIYOI;NIRAJI RANJIYAN
分类号 H01L27/04;H01L21/3205;H01L21/76;H01L21/822;H01L21/8234;H01L21/8238;H01L23/52;H01L27/088;H01L27/092;H01L29/06;H01L29/40;H01L29/78;(IPC1-7):H01L21/823 主分类号 H01L27/04
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