| 摘要 |
PURPOSE:To fill multiple cavities, made in a circuit board, efficiently with sealing resin. CONSTITUTION:A serial cavity circuit board 10 having multiple cavities 12 is applied sequentially with a sealing resin sheet 20 composed of crosslinked polyolefin, a surface mold releasing sheet 31, and a weight plate 32. It is then placed in a vacuum heating furnace 33 and heated under vacuum. Consequently, the sealing resin sheet 20 is fused and fills each cavity 12. When the serial cavity circuit board 10 is heated furthermore, the fused resin filling each cavity 12 is cured. |
