发明名称 CIRCUIT COMPONENT FIXING METHOD
摘要 PURPOSE:To connect and fix a circuit component such as a bus bar or terminal fast to a circuit board simply and certainly. CONSTITUTION:By means of vacuum molding, etc., a thermoplastic resin plate 41 heated and softened is intruded into the lower space 52 of a horizontal projection 44 and/or a detaining hole 45 in the elevation direction in a circuit component 40. Suction holes 471, 473 in a vacuum molding die 43 are put in communication with the detaining hole and/or the lower space. A detaining hole and/or a projection is provided in/on a circuit component riser piece, pressure contacting piece 42, and/or loop piece. A communication groove for the suction holes is provided in the folded-back part formed on the riser piece on the down side of the projection. An air bleeder hole 472 confronting an electric wire 53 is furnished in the circuit component equipped with pressure contacting piece so that the air in the lower space of the electric wire is sucked, and the resin plate is intruded. A circuit 9 is formed on the resin plate and put in tight attachment to and connected with the top edge of the detaining hole 45 and/or the projection 45 simultaneously with intrusion of the resin plate into the detaining hole and/or the lower space of the projection.
申请公布号 JPH0845639(A) 申请公布日期 1996.02.16
申请号 JP19940182350 申请日期 1994.08.03
申请人 YAZAKI CORP 发明人 SAKAKIBARA YUTAKA
分类号 H01R43/20;H01R9/16;H05K3/00;H05K3/20;H05K7/06;(IPC1-7):H01R43/20;H01R9/09 主分类号 H01R43/20
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