| 摘要 |
PURPOSE:To alleviate stress generated between a board and sealing resin and to shorten length of wiring arranged between a semiconductor element and external connecting terminals in a semiconductor device with a package structure of a BGA(Ball Grid Array) type and a method of manufacture. CONSTITUTION:A semiconductor element 12, a multilayer printed circuit board 11 that is arranged with the semiconductor element 12 and with solder balls 14 that connect a mounting surface 11b with the semiconductor element 12 electrically, and sealing resin 15 that is arranged to the multilayer printed circuit board 11 for the sealing of the semiconductor element 12, are provided. A storing part 17, inside which the semiconductor element 12 is stored, is formed on the multilayer printed board 11, a supporting member 13, that fixes the semiconductor element 12 inside the storing part 17, is arranged on the multilayer printed board 11 and the sealing resin 15 is arranged so that it covers whole part of the semiconductor element 12 including the supporting member 13. |
