| 摘要 |
<p>PURPOSE:To reduce the warpage of a wiring board, and to lower the dispersion of the height of a bump electrode by mounting a semiconductor chip and a sealing body consisting of a resin covering a connection means so as to be stuck on the main surface side of the wiring board, forming one indentation to the surface of the sealing body and thinning the resin on the bottom of the indentation. CONSTITUTION:A semiconductor chip 2 is fixed on the main surface side of a wiring board 1, and the electrodes 3 of the semiconductor chip 2 and the wirings 4 of the wiring board 1 are connected by wires 6. The wires 6 and the semiconductor chip 2 are covered with a package 7 as a sealing body composed of a resin. One indentation 20 is formed to the surface of the package 7, and the resin on the bottom of the indentation 20 is thinned. Accordingly, the warpage of the wiring board 1 can be reduced, and the dispersion of the height of bump electrodes 9 formed on the rear of the wiring board 1 can be diminished.</p> |
