ELECTRONIC ELEMENT PACKAGE AND ITS PRODUCTION

摘要

PURPOSE:To restrain an electronic element from inclining in a package or being exposed to the outside of the package by interposing a spacer between a lead wire and the outer edge of a protective member extending in parallel with the surface of the electronic element. CONSTITUTION:An electronic element 7 bonded with a film carrier is set in a molding die formed between upper and lower dies 8, 9 and a molding material 11 is injected through a gate 10 made in the lower die 9 before being heated. In this regard, it is urged against a surface extending in parallel with the surface of an inner lead 2 and the surface of the electronic element 7 set in the upper die 8. The gate 10 is provided on the side of the lower die 9 so that the electronic element 7 and the inner lead 2 is slightly subjected to the flow of the molding material 1 on the side of the spacer 5. This structure restrains the electronic element from inclining in the package.