| 摘要 |
PURPOSE:To obtain a method for preventing interfacial exfoliation between a ceramic and a thin organic insulating film. CONSTITUTION:A cover pad is previously provided on a ceramic board 1 closely to the end part of a thin organic insulating film 11. Unnecessary part of the thin organic film is then removed and a nickel/gold plating film is formed on the cover pad thus covering the end face of the organic insulating film 11 and the vicinity of the ceramic board 1 with the plating film. This structure prevents interfacial exfoliation between the ceramic and the organic insulating film effectively. |
