RESIN-SEALED SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

摘要

PURPOSE:To eliminate a chip defect such as a short-circuit defect by a method wherein a sealing resin molded unit is heated in a heated metallic recess and a recessed shape resin molded unit at least whose sealing surface is made of uncured resin. CONSTITUTION:After a resin sheet is cut into the required size, the sheet is put onto TQFP 1000-pin molding molds 20 and molded at the mold temperature of 120 deg.C to form a recessed shape resin molded unit 1. Then the surfaces and rears of outer lead components are temporarily fixed to the uncured resin parts of the recessed shape resin molded units 1 and 2 under a heated state and then the resin molded units 1 and 2 are pressed and cured with the molds 20 surrounding the outer circumferences of the recessed shape resin molded units 1 and 2. The molds 20 surrounding the outer circumferences have 14X14X0.6mm cavities. A semiconductor chip is sandwiched between the recessed shape resin molded units 1 and 2 and molded with the units 1 and 2 into one piece by the molds 20 at a temperature of 175 deg.C for 15 seconds. Then the after cure at a temperature of 175 deg.C for 8 hours, a moisture absorption treatment at a relative humidity of 85% for 168 hours and an infrared radiation reflow treatment at a temperature of 240 deg.C are successively performed.