INTRINSIC GETTERING METHOD OF SILICON WAFER,申请号JP19940177940-传众专利搜索

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发明名称	INTRINSIC GETTERING METHOD OF SILICON WAFER
摘要
申请公布号	JPH0845945(A)	申请公布日期	1996.02.16
申请号	JP19940177940	申请日期	1994.07.29
申请人	MITSUBISHI MATERIALS CORP;MITSUBISHI MATERIALS SHILICON CORP	发明人	SATO HIROKI;FURUYA HISASHI
分类号	H01L21/322;(IPC1-7):H01L21/322	主分类号	H01L21/322
代理机构		代理人
主权项
地址

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