| 摘要 |
PURPOSE:To obtain a lead frame in which the mold resin is protected against crack and a method for producing a semiconductor device using that lead frame. CONSTITUTION:The lead frame 1 is provided, substantially in the center of a pad 2 for supporting a semiconductor chip element 10, with a through hole 21 of substantially same size as the outline of the semiconductor element 10. The supporting pad 2 is expanded at first to enlarge the through hole as compared with the outline of the semiconductor element 10. Under that state, the semiconductor element 10 is inserted halfway into the through hole 21 and then the supporting pad 2 is contracted to reduce the size of the through hole 21 before the semiconductor element 10 is supported and secured in place. |
