SEMICONDUCTOR CHIP PACKAGE

摘要

PURPOSE: To enhance thermal performance by providing a plastic molding for receiving a lead frame and a semiconductor chip while exposing the inactive back face of a chip to the outside of a package thereby conducting heat generated from the chip through a plastic package. CONSTITUTION: Lateral dimension of a semiconductor chip 20 having active front face 26 and inactive back face 27 is set smaller than the opening of a lead frame 23 so that the semiconductor chip 20 can be received without being supported perfectly by the lead frame 23 on the inactive back face 27 thereof. A bonding wire 24 is extended between the active front face 26 of the lead frame 23 and the lead frame 23 and the semiconductor chip 20 is received in plastic molding 32 along with the lead frame 23 while exposing the inactive back face 27 to the outside of a package 31. Consequently, heat generated from the semiconductor chip 20 is conducted through the package 31 and the thermal performance is enhanced.