SURFACE MOUNTING TYPE SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURE AND SEMICONDUCTOR DEVICE

摘要

PURPOSE:To enable mounting without adversary effect to a package body in case a coefficient of thermal expansion between the package body and a mounting board is not matched. CONSTITUTION:One end part of a wiring pattern 20a formed on a base film 20b, that is provided with a package body 10 formed with inner wiring and/or surface wiring and with a film 20 of which wiring pattern is adhered to an outer surface of the package body through an elastic body layer 2 and that has an electric insulation of the film 20 with wiring pattern, is connected with external connecting terminals 18 and the other end part of the wiring pattern 20a is electrically connected with the external connecting terminals formed on the package body.