SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

摘要

PURPOSE:To prevent recesses from occurring in a buried wiring layer or a buried bonding pad when a conductive film is buried in a groove through a polishing method so as to protect the conductive film against disconnection. CONSTITUTION:Grooves are cut in an insulating film 15 provided onto a silicon semiconductor substrate 1 corresponding to a conductive pattern 16 so as to enable a non-conductive region 8 to be located inside the buried conductive pattern 16, a conductive film is deposited on all the surface including the grooves, and then the conductive film is removed off excluding the grooves through a polishing method for the formation of the buried conductive pattern 16.