| 摘要 |
PURPOSE:To obtain a semiconductor device with check pin in which the electric characteristics of lead pin can be checked easily and accurately. CONSTITUTION:Check pins 1 are provided at the upper part of an IC package. The check pin 1 is planted, on the lower end side, into a sealing material 5 and connected with a lead pin 6 in the sealing material 5. Since the check pin is protected against bending, mutual contact is prevented and the electric characteristics can be tested accurately. |
