发明名称 HEAT PIPE
摘要 <p>PURPOSE:To permit the dissipation of heat in a main body unit efficiently by a method wherein a heat receiving plate, consisting of a good conductor of heat, is communicated with a heat dissipation plate by a sealed vessel consisting of a flexible tube while a wick, consisting of a braided wire having elasticity, is provided in the sealed vessel. CONSTITUTION:A heat pipe 100 is provided with a heat receiving plate 110, consisting of a good conductor of heat, and a heat dissipation plate 130 when the heat pipe is applied in a note type computer while both of the plates 110, 130 are integrated through a container 20, whose inside is constituted of a heat transporting medium. The container 120 is cylindrical and provided with a space therein while this space and spaces in both of the plates 110, 130 are evacuated. On the other hand, the container 120 is formed of a flexible tube of silicone rubber or the like while a braided wire of nylon, glass, copper or the like, which serves as a wick 140, is provided in the inner space. According to this method, heat in a main body unit can be dissipated effectively without changing the arrangement of electronic parts and the like.</p>
申请公布号 JPH0842983(A) 申请公布日期 1996.02.16
申请号 JP19940197265 申请日期 1994.07.28
申请人 DIAMOND ELECTRIC MFG CO LTD 发明人 ISHIDA YOSHIO
分类号 F28D15/02;G06F1/20;H05K7/20;(IPC1-7):F28D15/02 主分类号 F28D15/02
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