发明名称 MULTIPOINT TEMPERATURE MONITORING APPARATUS FOR SEMICONDUCTOR WAFERS DURING PROCESSING
摘要 <p>An emissivity compensating non-contact system for measuring the temperature of a semiconductor wafer (24). The system includes a semiconductor wafer emissivity compensation station (10) for measuring the reflectivity of the wafer (24) at discrete wavelengths to yield wafer emissivity in specific wavelength bands. The system further includes a measurement probe (13) which is optically coupled to a semiconductor process chamber (12). The probe (13) senses wafer self-emission using one or more optical detectors (40) and a light modulator (42). A background temperature determining mechanism (44) independently senses the temperature of a source (46) of background radiation. Finally, a mechanism (16) calculates the temperature of the semiconductor wafer based on reflectivity and self-emission of the wafer and background temperature.</p>
申请公布号 WO1996004534(A1) 申请公布日期 1996.02.15
申请号 US1995008521 申请日期 1995.07.12
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