Mfg. constructional unit according to anodic bonding method

摘要

Mfg. a constructional unit according to the anodic bonding method with a first constructional part (1) and a second constructional part (2), pref. consisting of Si, comprises applying a bonding layer (11), esp. a glass layer, onto the first constructional unit (1), laying the second constructional unit (2) on the bonding layer (11), pressing the units (1,2) against one another and heating to a predetermined temp.. A predetermined voltage is applied to the first and second units to produce a bond between them. The first unit (1) and the bonding layer (11) and/or the second unit (2) are structured such that a hollow space (12) bordering the first and/or second unit(s)is formed in the first and/or second unit(s). The first (1) and second (2) units are pressed together by producing a vacuum in the hollow space (12). Also claimed is a constructional unit having at least a first constructional unit (1) bonded to a second constructional unit by anodic bonding. The first and/or second unit(s) has at least one continuous opening (15).