摘要 |
A method is disclosed of simultaneously laminating circuitized dielectric layers to form a multilayer high performance circuit board and making interlevel electrical connections. The method selects two elements which will form a eutectic at one low temperature and will solidify to form an alloy which will only remelt at a second temperature higher than any required by any subsequent lamination. The joint is made using a transient liquid bonding technique and sufficient Au and Sn to result in a Au-Sn20wt% eutectic at the low temperature. Once solidified, the alloy formed remains solid throughout subsequent laminations. As a result, a composite, mulilayer, high performance circuit board is produced, electrically joined at selected lands by the solid alloy. <IMAGE> |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORP., ARMONK, N.Y., US |
发明人 |
DAVIS, CHARLES R., ENDICOTT, NEW YORK 13760, US;HSIAO, RICHARD, WAPPINGERS FALLS, NEW YORK 12590-5155, US;LOOMIS, JAMES R., BINGHAMTON, NEW YORK 13905, US;PARK, JAE M., SOMERS, NEW YORK 10589, US;REID, JONATHAN D., JOHNSON CITY, NEW YORK 13790, US |