| 摘要 |
PURPOSE:To relieve an outer lead of poor forming, insufficiency in strength, and deformation and thereby to improve and stabilize semiconductor device qualities by a method wherein a groove is provided along the length of the primary surface of an outer lead bent portion of a semiconductor device with the outer lead protruding from its envelope. CONSTITUTION:An outer lead 11 protruding from the side of a resin-sealed envelope 105 is provided with a groove 12. The groove 12 is formed in the inner surface of the bent portion of the outer lead 11 and runs along the length of the outer lead 11. the groove 12 may be easily provided by chemical etching during a lead frame manufacturing process or by punching during a pressing process. The groove 12 may be a triangular groove 12a, elliptical (semicircular) groove 12b, or angular groove 12c. The depth suitable for the groove 12 depends on the type of a semiconductor device, material of a lead frame, design of the lead frame, or the geometry of the groove 12, and work effectively when it is somewhere between 10-40%. |
