| 摘要 |
A cooling structure which is used for forced cooling of an electronic circuit package such as an integrated circuit is disclosed. The cooling structure comprises a tubular fin member having many through-holes of small diameter, a flat plate member which is joined to and seals one end of the tubular fin member, a lid member attached to the other end of the tubular fin member and a pipe member used as a nozzle from which coolant is jetted towards the plate member. Both the tubular fin member and the plate member are made of a material having high heat conductivity. The pipe member extends through the lid member or is inserted through an opening formed in the lid member. The electronic circuit package is fixed to the plate member.
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