| 摘要 |
<p>PURPOSE: To easily remove silicon dust remaining on a wafer by providing a silicon duct cleaning portion with a first cutting water supply for supplying cutting water to a friction area between a wafer and a grinding wheel and a second cutting water supply added, if required. CONSTITUTION: A grinding portion has a grinding wheel 1 for performing a grinding process for a wafer 3 held on a vacuum chuck table 2, while supplying cutting water from nozzles 11, 12 different in injection direction in the grinding process. That is, because silicon dust 102 tends to be diffused in front of the wafer 3 by the flow 101 of the cutting water from the nozzle 11 during grinding, the flow 104 of the cutting water via the nozzle 12 is added to narrow an area adapted to be polluted by the silicon dust 102. After grinding process, the silicon dust 105 remaining on the wafer 3 is removed by a cleaning portion for jetting cleaning waters 201, 202 to both sides of the wafer 3 at the same time.</p> |
