发明名称 |
Apparatus for evaluating characteristics of semiconductor device and method of evaluating characteristics of semiconductor device using the same |
摘要 |
A probe is attached to a support plate vertically to the surface of the support plate. A drop of a molten metal is formed at a tip portion of the probe. The support plate has a heater for setting the temperature of the probe and the drop of the molten metal at the tip portion of the probe. The probe is situated at a position corresponding to a position of an electrode of an LSI. The probe is connected to a measuring device for evaluating characteristics of the LSI by wiring. The drop of the molten metal connects the probe and the electrode of the LSI electrically.
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申请公布号 |
US5491425(A) |
申请公布日期 |
1996.02.13 |
申请号 |
US19940215774 |
申请日期 |
1994.03.22 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
WATANABE, TORU;YONEKURA, YURI;OKUMURA, KATSUYA |
分类号 |
G01R1/073;G01R1/067;G01R31/26;H01L21/66;(IPC1-7):G01R1/06 |
主分类号 |
G01R1/073 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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