| 摘要 |
The invention prevents solder bridges that will easily occur in soldering an element whose leads are narrow in spacing. In a solder resist (20), there is provided an excess-solder absorbing region (24) in which solder resist is not provided, to the distal end of a lead (14) more than an end (22A) of a solder pad (22). When a great deal of solder paste is applied to the solder pad (22) in soldering the lead (14), an excess of solder (28) melted due to the heat of a heater flows along the lead (14) and into the excess-solder absorbing region (24) toward the distal end of the lead (14). Since the excess of solder 28 does not flow across the solder resist (20) provided between the leads (14), no solder bridge is formed. <MATH> |
