Direct chip attach

摘要

The area required for wirebond direct chip attach on a flexible substrate 30 is reduced by countersinking the chip 10. A spacer layer 70 or an indentation in a heatsink 20 may be used to recess a chip 10 relative to a flexible substrate 30. This enables shorter wirebonds 40 and less encapsulation 60 to be employed. A protection layer 50 is applied over a wiring pattern carried by the substrate 30.