| 摘要 |
PURPOSE:To improve defective bonding of a metal post and a wire by a method wherein the area of a soldering surface is set to be smaller than an upper surface area and the weight per unit area acting on solder paste is increased and the metal post is bitten into the solder paste in a good-balanced manner. CONSTITUTION:Solder paste 14 is printed in a pattern on a conductive pattern 13 and a recess part 11a is formed in a center part on a bottom surface of a metal post 11. When the such-structured metal post 11 is mounted to an electrode substrate 33, since the area of a bottom surface 11b of the metal post 11 is smaller than that of an upper surface 11c of the metal post 11, the weight of the metal post 11 acting per unit area in solder paste 14 is increased and the metal post 11 is bitten into the solder paste 14 in a good-balanced manner, and further when soldering, since reaction gas generated by chemical reaction can be collected in the recess part 11a, the metal post 11 can horizontally be collected to the electrode substrate 33. Thus, defective bonding of the wire and metal post 11 can be improved. |
