| 摘要 |
<p>PURPOSE:To provide a method of preserving a mapping data of a semiconductor wafer capable of evading a reduction in a manufacturing yield due to scattering of aluminum without using an external memory medium and further detecting a stable mark. CONSTITUTION:A mapping data and an address reference mark being an arrangement data of acceptable and defective semiconductor chips within a semiconductor wafer 20 are printed in a labeled tape 30 and sticked to within the semiconductor wafer 20, whereby the mapping data and address reference mark of acceptable and defective semiconductor chips are formed within the same semiconductor wafer.</p> |
