首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
WAFER PLATING APPARATUS
摘要
申请公布号
JPH0837189(A)
申请公布日期
1996.02.06
申请号
JP19940169878
申请日期
1994.07.22
申请人
MATSUSHITA ELECTRON CORP
发明人
TETANI MICHINARI;MATSUMURA TAKASHI
分类号
C25D7/12;H01L21/321;H01L21/60;(IPC1-7):H01L21/321
主分类号
C25D7/12
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Fluid purification level control apparatuses and methods
Pool cleaning vehicle having improved logic
Grey water filtering system
High resolution focusing and separation of proteins in nanofluidic channels
Non-volatile addressable electronic paper with gray level capability
Electrochemical gas sensor with an ionic liquid electrolyte system including at least one monoalkylammonium, dialkylammonium, or trialkylammonium cation
Method of repairing an aircraft structure component
Substrate processing apparatus with composite seal
Asymmetrical wafer configurations and method for creating the same
Cement compositions with a high-density additive of silicon carbide or sintered bauxite
Polymer blends and carbonized polymer blends
Processes for preparing valve metal powders, powders prepared thereby and uses therefor
4-aminoindole derivatives and use thereof for the oxidation dyeing of keratin fibres
Vertebral joint implants and delivery tools
Bone plate system
Cardiac mapping instrument with shapeable electrode
Adapter device
Dosage control for drug delivery system
Disposable absorptive article
Controlling a phacoemulsification system based on real-time analysis of image data
