| 摘要 |
PURPOSE:To obtain a semiconductor device lead frame, having an excellent positional accuracy, on which a heat sink is junctioned by a method wherein an insulative bonding tape is adhered to an inner lead part without positional deviation, sealing resin is spread to all corners so as to prevent generation of cracks and twisting of lead. CONSTITUTION:An inner lead 2 and an outer lead are successively formed linking to the external circumference of a semiconductor chip providing region 1, they are annealed, the inner lead is coined, the tip part of the inner lead is pantially plated, an insulating adhesive tape 11 is adhered to the reverse side of plating of the inner lead, the tip part of the inner lead and the insulating adhesive tape are punched simultaneously, and a heat sink is provided on the inner lead part through the insulating adhesive tape 11, which is left in frame shape, in the title lead frame manufacturing method. Also, a hole is formed between the circumference of the semiconductor chip providing region and the connection part at the tip of the inner lead. |
