PRINTED WIRING BOARD ON WHICH ELECTRONIC PARTS WITH BUMP ELECTRODES ARE MOUNTED, AND ITS MOUNTING METHOD

摘要

PURPOSE:To easily and efficiently detect the bonding condition of bump electrodes dispersed in size in mounting bump electrode-attached electronic parts on a printed wiring board. CONSTITUTION:Among bump electrodes 2 dispersed in size, inspecting electrodes 2b having smaller diameters than those having smaller diameters are formed on a base board 1a for electronic parts and interconnected in the electronic parts. A conductor interconnection for connecting probes to conductive parts to which the inspecting electrodes 2b of smaller diameters are to be bonded is formed on a printed wiring board. After the electronic parts 2 have been mounted on the printed wiring board, the probes are connected to the conductor interconnection, thereby inspecting the electric continuity of the entire conductor interconnection.