SEMICONDUCTOR DEVICE, TRANSFER METHOD, CHECK METHOD, AND MOUNTING METHOD THEREOF

摘要

PURPOSE:To provide a semiconductor device and a manufacturing and mounting technique thereof, wherein leads can be easily protected against bend caused by a mechanical stress which acts directly on them in a transfer process or a selection process. CONSTITUTION:An insulating tape 3 of organic material such as polyimide resin is fitted to the underside of a semiconductor device 1. Cutouts 4 are provided to the periphery of the insulating tape 3 corresponding to external lead-out leads 2. The insulating tape 3 is provided to the underside of a semiconductor device making the external lead-out leads 2 fitted in the cutouts 4. As mentioned above, an insulating tape provided with cutouts corresponding to the tips of outer lead-out leads is provided to the underside of a sealed body, whereby the outer lead-out leads are fixed in a lateral direction as the leads are fitted in the cutouts provided to the tape. Therefore, leads are protected against bend caused by an external force.