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发明名称
SEMICONDUCTOR DEVICE LEAD CUTTING METHOD AND DEVICE
摘要
申请公布号
JPH0837262(A)
申请公布日期
1996.02.06
申请号
JP19930164949
申请日期
1993.07.05
申请人
SONY CORP
发明人
SHIMURA HIDEO
分类号
H01L23/50;(IPC1-7):H01L23/50
主分类号
H01L23/50
代理机构
代理人
主权项
地址
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