| 摘要 |
PURPOSE:To provide a semiconductor device that is easy to mount and excellent in reliability when bonding pads are arranged at small patches. CONSTITUTION:In a first semiconductor device, onto an insulation tape 2 formed with a conductive pattern 1 on the surface, namely on the rear surface side of a TAB substrate, a support substrate 4 of heat conductivity in which is a semiconductor chip 3 is fixed to a recess part is mounted, and on the surface side of the insulation tape, solder balls 5 are arranged so as to connect with the conductive pattern 1 on the surface side via a hole. |
