发明名称 MULTILAYRED WIRING BOARD WITH TERMINAL
摘要 PURPOSE:To obtain a multilayered wiring board with terminal which is improved in workability and efficiency by extending wiring with resin layer composed of wiring and a resin layer provided on the surface of a substrate from the substrate and providing terminals to the extended part. CONSTITUTION:As shown in the figure, wiring with a resin layer composed of wiring and a resin layer provided on the surface of a board housing multilayered wiring is extended from the substrate and terminals are provided to the extended part. Or, the terminals can be provided on both surfaces of the for electrically connecting the wiring provided to the boards. The board has an interlayer connecting hole extended part and wiring immediately below the wiring. In addition, the resin layer of the extended part is composed mainly of an epoxy resin or phenol resin. Therefore, connection between wiring boards and between wiring boards and electronic parts can be easily made through fewer processes without using any expensive material.
申请公布号 JPH0837380(A) 申请公布日期 1996.02.06
申请号 JP19940169539 申请日期 1994.07.21
申请人 HITACHI CHEM CO LTD 发明人 OGINO HARUO;TSUYAMA KOICHI;NAKASO AKISHI;OTSUKA KAZUHISA;KIDA AKINARI;TAMURA YOSHIHIRO
分类号 H05K1/02;H05K1/03;H05K1/11;H05K3/40;H05K3/46 主分类号 H05K1/02
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