| 摘要 |
PURPOSE:To obtain a thin type multipin-formed and low thermal resistance semiconductor at low cost. CONSTITUTION:A substrate 1, consisting of high heat-resisting epoxy resin containing 0.3mm thick glass cloth, is formed into 10mm square shape, and an insulating bonding agent layer 2 is formed on one side of the substrate 1 in the thickness of about 50mum using a screen printing method, and a copper alloy lead frame 3 is adhered to the insulating adhesive agent layer 2 by curing the layer 2 after the lead frame 3 has been laminated on the prescribed position in a highly precise manner. A semiconductor element 4 is fixed to the substrate 1 by an insulative bonding agent layer, and the electrode on the semiconductor element 4 and the inner lead of the lead frame 3 are electrically connected by a gold fine wire 6 of 25mum phi. Besides, in order to obtain a thin type package, the highest loop height of the gold fine wire 6 is limiteto 180mum based on the surface of the semiconductor element 4 by optimizing the set value of the bonding parameter of a bonder and by selecting the gold fine wire 6 of low loop and high strength. |
