发明名称 METHOD FOR FORMING ELECTRODE OF ELECTRONIC PART
摘要 PURPOSE:To obtain a defectless electrode by dipping the end section of an electronic part into raw material paste for electrodes, attaching the raw material paste for electrodes to this end section, lifting the electronic part up, bringing this end section into contact with the surface of a panel having protrusions and recessions surrounded by these protrusions, and preventing air from being swallowed up. CONSTITUTION:Raw material paste 2 for electrodes is applied on to the upper surface of a horizontal board 1, and is made to have a specified thickness by a squeeze plate. The end section of an electronic part 4 is dipped in the raw material paste 2 for electrodes until it touches the board 1, and the raw material paste 2 for electrodes is attached to the end section. And the end section of the electronic part 4 is lifted up from the raw material paste 2 for electrodes. On this occasion, swallowed in air 6 by the difference of the wettability of the electronic part 4 is produced in the raw material paste 2 for electrode attached to the end section. After the end section of the electronic part 4 is moved on to a panel 7 having latticelike protrusions and recessions surrounded by these protrusions, it is separated. The raw material paste 2 for electrodes attached to the end section of the electronic part 4 is solidified, and an external electrode 5 is obtained.
申请公布号 JPH0837136(A) 申请公布日期 1996.02.06
申请号 JP19940172779 申请日期 1994.07.25
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KIMURA TAKESHI;IKEDA KIMIHIKO;WADA KENJI
分类号 H01G4/30;H01G13/00 主分类号 H01G4/30
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